Materials & Resources » Chemicals | Japan Pure Chemical Co. Ltd.

Japan Pure Chemical Co. Ltd. | Balance Sheet

Fiscal year is April-March. All values JPY Millions.
2014
2015
2016
2017
2018
2019
Cash & Short Term Investments
4,199
4,414
4,541
4,298
4,394
4,838
Total Accounts Receivable
1,183
1,355
1,362
1,630
1,897
1,691
Inventories
255
197
179
250
399
449
Other Current Assets
44
50
44
38
47
12
Total Current Assets
5,681
6,016
6,126
6,215
6,738
6,991
Net Property, Plant & Equipment
124
100
115
104
103
121
Total Investments and Advances
2,934
4,548
3,341
4,792
6,388
4,501
Intangible Assets
47
39
24
31
144
136
Other Assets
4
4
14
12
47
51
Total Assets
8,791
10,706
9,619
11,154
13,420
11,799
Accounts Payable
241
232
179
216
360
Income Tax Payable
171
230
139
146
229
Other Current Liabilities
118
128
127
132
131
Total Current Liabilities
530
590
445
494
720
Provision for Risks & Charges
325
39
39
39
40
Deferred Taxes
329
781
361
794
1,281
Other Liabilities
-
286
278
278
278
Total Liabilities
1,184
1,696
1,124
1,606
2,319
Common Equity (Total)
7,607
9,010
8,495
9,548
11,101
Total Shareholders' Equity
7,607
9,010
8,495
9,548
11,101
Total Equity
7,607
9,010
8,495
9,548
11,101
Liabilities & Shareholders' Equity
8,791
10,706
9,619
11,154
13,420

About Japan Pure Chemical Co.

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Address
3-10-18 Kita-machi
Tokyo Tokyo 179
Japan
Employees -
Website http://www.netjpc.com
Updated 07/08/2019
Japan Pure Chemical Co., Ltd. engages in the development, manufacture and sale of noble metal plating chemicals for electronic devices. It offers gold electroplating formulation for semiconductor applications, connectors, contacts, and soldering uses; palladium electroplating formulation for connectors, lead frames, and decorative uses. The company provides gold coating for soldering and wire bonding; electroless palladium plating formulation for wire bonding and soldering uses; and silver plating formulations.

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