Materials & Resources » Chemicals | Sumitomo Bakelite Co. Ltd.

Sumitomo Bakelite Co. Ltd. | Balance Sheet

Fiscal year is April-March. All values JPY Millions.
2014
2015
2016
2017
2018
2019
Cash & Short Term Investments
41,341
49,966
44,876
49,498
56,559
59,640
Total Accounts Receivable
41,932
44,766
41,783
43,662
48,643
47,858
Inventories
26,975
31,084
29,088
29,024
30,943
34,825
Other Current Assets
5,954
6,415
7,767
3,087
3,209
4,448
Total Current Assets
116,202
132,231
123,514
125,271
139,355
146,771
Net Property, Plant & Equipment
87,426
92,698
87,325
93,748
94,760
95,488
Total Investments and Advances
21,064
24,617
17,992
25,566
27,684
34,888
Long-Term Note Receivable
1,583
1,921
1,729
-
-
-
Intangible Assets
5,953
30,489
26,446
6,528
6,389
4,046
Other Assets
3,947
3,528
2,630
1,753
3,199
2,619
Total Assets
236,825
285,927
260,122
253,763
272,247
284,898
ST Debt & Current Portion LT Debt
23,763
25,979
13,879
9,596
10,408
Accounts Payable
30,587
29,721
26,115
28,966
31,332
Income Tax Payable
1,084
1,283
2,870
2,549
2,478
Other Current Liabilities
12,704
13,720
13,204
14,501
14,809
Total Current Liabilities
68,138
70,703
56,068
55,612
59,027
Long-Term Debt
11,300
35,087
37,018
34,411
33,286
Provision for Risks & Charges
3,257
3,725
4,415
3,442
3,474
Deferred Taxes
2,299
4,259
2,508
2,920
4,826
Other Liabilities
837
761
719
282
267
Total Liabilities
86,481
114,978
101,214
97,564
101,740
Common Equity (Total)
148,936
169,215
157,319
154,222
168,450
Total Shareholders' Equity
148,936
169,215
157,319
154,222
168,450
Total Equity
150,344
170,949
158,908
156,037
170,262
Liabilities & Shareholders' Equity
236,825
285,927
260,122
253,601
272,002
Accumulated Minority Interest
1,408
1,734
1,589
1,815
1,812

About Sumitomo Bakelite Co.

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Address
Tennoz Parkside Building
Tokyo Tokyo 140
Japan
Employees -
Website http://www.sumibe.co.jp
Updated 07/08/2019
Sumitomo Bakelite Co., Ltd. engages in the manufacture and sale of phenolic resin and plastic products. It operates through the following segments: Semiconductor Materials, Circuit Products, High-performance Plastics, Quality of Life Products, and Others. The Semiconductor Materials segment includes epoxy resin molding compounds for encapsulation of semiconductor devices; positive-type photosensitive coating resins for semiconductor wafers; pastes for die bonding; carrier tapes for mounting semiconductor components; adhesive tapes for assembling semiconductors; and semiconductor substrate materials.