Materials & Resources » Chemicals | Sumitomo Bakelite Co. Ltd.

Sumitomo Bakelite Co. Ltd. | Income Statement

Fiscal year is April-March. All values JPY Millions.
2014
2015
2016
2017
2018
2019
Sales/Revenue
206,047
209,659
206,956
198,100
211,819
212,952
Cost of Goods Sold (COGS) incl. D&A
153,239
152,970
149,067
138,636
148,633
151,917
Gross Income
52,808
56,689
57,889
59,464
63,186
61,035
SG&A Expense
42,106
45,785
47,648
42,806
43,935
43,742
EBIT
10,702
10,904
10,015
-
19,251
17,293
Unusual Expense
555
785
4,209
4,342
363
2,305
Non Operating Income/Expense
359
1,091
1,417
191
233
866
Interest Expense
273
303
301
138
77
235
Pretax Income
10,540
11,344
7,410
12,715
19,495
19,548
Income Tax
3,929
4,113
3,406
2,952
4,197
4,298
Consolidated Net Income
6,611
7,231
4,004
9,763
15,298
15,251
Net Income
6,493
7,113
3,828
9,521
15,078
15,084
Net Income After Extraordinaries
6,493
7,113
3,828
9,521
15,078
15,084
Net Income Available to Common
6,493
7,113
3,828
9,521
15,078
15,084
EPS (Basic)
26.96
29.53
16.01
40.46
64.07
320.51
Basic Shares Outstanding
241
241
239
235
235
47
EPS (Diluted)
26.95
29.53
16.01
40.46
64.07
320.51
Diluted Shares Outstanding
241
241
239
235
235
47
EBITDA
22,086
21,451
22,509
26,563
29,044
27,445
Other Operating Expense
-
-
226
-
-
-
Non-Operating Interest Income
185
205
241
219
414
748
Minority Interest Expense
118
118
176
242
220
167
Equity in Affiliates (Pretax)
122
232
247
128
37
4,914

About Sumitomo Bakelite Co.

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Address
Tennoz Parkside Building
Tokyo Tokyo 140
Japan
Employees -
Website http://www.sumibe.co.jp
Updated 07/08/2019
Sumitomo Bakelite Co., Ltd. engages in the manufacture and sale of phenolic resin and plastic products. It operates through the following segments: Semiconductor Materials, Circuit Products, High-performance Plastics, Quality of Life Products, and Others. The Semiconductor Materials segment includes epoxy resin molding compounds for encapsulation of semiconductor devices; positive-type photosensitive coating resins for semiconductor wafers; pastes for die bonding; carrier tapes for mounting semiconductor components; adhesive tapes for assembling semiconductors; and semiconductor substrate materials.

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