Industrial Goods » Industrial Electronics | Aspocomp Group Oyj

Aspocomp Group Oyj | Balance Sheet

Fiscal year is January-December. All values EUR Thousands.
2013
2014
2015
2016
2017
2018
Cash & Short Term Investments
2,380.00
735.00
268.00
258.00
384.00
2,565
Total Accounts Receivable
3,434.00
3,872.00
3,311.00
4,117.00
4,920.00
8,714
Inventories
2,615.00
2,050.00
2,384.00
2,622.00
2,755.00
2,332
Other Current Assets
133.00
53.00
284.00
422.00
484.00
-
Total Current Assets
8,562.00
6,710.00
6,247.00
7,419.00
8,543.00
13,611
Net Property, Plant & Equipment
4,003.00
2,890.00
2,157.00
2,499.00
2,572.00
4,941
Total Investments and Advances
14.00
15.00
15.00
15.00
15.00
15
Intangible Assets
3,105.00
3,061.00
3,066.00
3,216.00
3,268.00
3,281
Total Assets
17,810.00
14,934.00
13,796.00
15,744.00
17,415.00
25,833
ST Debt & Current Portion LT Debt
744.00
704.00
1,176.00
693.00
508.00
Accounts Payable
1,686.00
997.00
1,716.00
3,217.00
2,394.00
Income Tax Payable
58.00
35.00
12.00
19.00
21.00
Other Current Liabilities
1,195.00
1,890.00
940.00
0.00
1,080.00
Total Current Liabilities
3,683.00
3,626.00
3,844.00
3,929.00
4,003.00
Long-Term Debt
1,279.00
535.00
107.00
819.00
1,003.00
Provision for Risks & Charges
266.00
118.00
358.00
357.00
402.00
Deferred Taxes
2,126.00
2,258.00
2,311.00
2,595.00
3,017.00
Other Liabilities
-
-
22.00
-
-
Total Liabilities
5,228.00
4,279.00
4,331.00
5,105.00
5,408.00
Common Equity (Total)
12,582.00
10,655.00
9,465.00
10,639.00
12,007.00
Total Shareholders' Equity
12,582.00
10,655.00
9,465.00
10,639.00
12,007.00
Total Equity
12,582.00
10,655.00
9,465.00
10,639.00
12,007.00
Liabilities & Shareholders' Equity
17,810.00
14,934.00
13,796.00
15,744.00
17,415.00

About Aspocomp Group Oyj

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Address
Keilaranta 1
Espoo UU 02150
Finland
Employees -
Website http://www.aspocomp.com
Updated 07/08/2019
Aspocomp Group Oyj engages in the design, manufacture, and sale of printed circuit boards (PCB). It provides its PCB trading services for the electronics industry. The company's products include High Density Interconnection, multilayer and backplane, metalback and PCB cooling solutions, high frequency PCBs, mixed dielectric PCBs, and Insulator Metal Substrates PCBs for LED application.