Applied Materials Inc. | Key People and Executives
Gary E. Dickerson
President, Chief Executive Officer & Director
Thomas J. Iannotti
Chairman
Scott A. McGregor
Independent Director
Judy Bruner
Independent Director
Adrianna C. Ma
Independent Director
Eric Chen
Independent Director
Aart J. de Geus
Independent Director
Andy A. Karsner
Independent Director
Stephen R. Forrest
Independent Director
Dennis D. Powell
Independent Director
Gary E. Dickerson
President, Chief Executive Officer & Director
Daniel J. Durn
Chief Financial Officer & Senior Vice President
Jay O. Kerley
Chief Information Officer & Group Vice President
Omkaram Nalamasu
Chief Technology Officer & Senior Vice President
Prabu Raja
SVP-Semiconductor Products Group
Mark G. Bingaman
MD-Tainan & Taiwan Manufacturing Site
Robert J. Perlmutter
Group VP & GM-Imaging and Process Control Group
Ginetto Addiego
Senior Vice President-Engineering
Robert J. Halliday
Head-Business Development
Ali Salehpour
Senior VP, GM-New Markets & Service Group
Robert Friess
Treasurer & Vice President
Charles W. Read
Chief Accounting Officer, VP & Controller
Ricky Gradwohl
Media Contact
Michael Sullivan
Investor Relations Contact
Madonna Bolano
Group Vice President & Head-Human Resources
Thomas F. Larkins
Secretary, Senior Vice President & General Counsel
Thomas J. Iannotti
Chairman
Scott A. McGregor
Independent Director
Judy Bruner
Independent Director
Adrianna C. Ma
Independent Director
Eric Chen
Independent Director
Aart J. de Geus
Independent Director
Alexander A. Karsner
Independent Director
Stephen R. Forrest
Independent Director
Dennis D. Powell
Independent Director
| Address |
3050 Bowers Avenue
Santa Clara California 95054
United States
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Employees
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| Website |
http://www.appliedmaterials.com |
| Updated |
07/08/2019 |
| Applied Materials, Inc. engages in the provision of materials engineering solutions used to produce new chip and advanced display. It operates through the following segments: Semiconductor Systems, Applied Global Services, and Display and Adjacent Markets. The Semiconductor Systems segment includes semiconductor capital equipment for deposition, etch, ion implantation, rapid thermal processing, chemical mechanical planarization, metrology and inspection, and wafer level packaging. |
