Technology & Telecommunication Services » Semiconductors | China Wafer Level CSP Co. Ltd.

China Wafer Level CSP Co. Ltd. | Income Statement

Fiscal year is January-December. All values CNY Thousands.
2013
2014
2015
2016
2017
2018
Sales/Revenue
447,934.40
614,192.20
568,287.20
505,111.70
619,953.80
557,378.20
Cost of Goods Sold (COGS) incl. D&A
198,292.80
296,147.10
365,840.20
346,000.60
402,070.50
418,963.40
Gross Income
249,641.70
318,045.10
202,447.00
159,111.00
217,883.30
138,414.90
SG&A Expense
75,595.50
132,423.80
120,245.90
133,884.10
143,779.40
152,315.60
EBIT
173,031.40
184,378.20
79,371.90
24,175.00
74,103.90
15,067.20
Unusual Expense
-
-
-
-
429.20
-
Non Operating Income/Expense
3,933.50
5,355.20
184.40
13,287.40
10,659.40
66,403.40
Interest Expense
515.80
212.90
276.50
80.20
63.80
71.50
Pretax Income
181,224.20
223,394.90
132,957.20
56,982.50
105,559.90
80,043.90
Income Tax
27,492.00
27,084.00
19,681.90
4,229.20
9,868.20
8,867.50
Consolidated Net Income
153,732.20
196,310.90
113,275.30
52,753.30
95,691.70
71,124.80
Net Income
153,732.20
196,310.90
113,275.30
52,753.30
95,691.70
71,124.80
Net Income After Extraordinaries
153,732.20
196,310.90
113,275.30
52,753.30
95,691.70
71,124.80
Net Income Available to Common
153,732.20
196,310.90
113,275.30
52,753.30
95,691.70
71,124.80
EPS (Basic)
0.68
0.88
0.50
0.23
0.42
0.31
Basic Shares Outstanding
226,697.00
223,080.50
226,697.00
226,697.00
226,697.00
229,679.50
EPS (Diluted)
0.68
0.88
0.50
0.23
0.42
0.31
Diluted Shares Outstanding
226,697.00
223,080.50
226,697.00
226,697.00
226,697.00
229,679.50
EBITDA
217,729.80
251,591.60
183,064.70
134,657.30
198,385.00
104,709.60
Other Operating Expense
1,014.80
1,243.20
2,829.20
1,052.00
-
1,166.50
Non-Operating Interest Income
2,976.30
16,747.60
22,002.60
12,116.50
21,289.80
28,779.30

About China Wafer Level CSP Co.

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Address
Suzhou Industrial Park
Suzhou Jiangsu 215026
China
Employees -
Website http://www.wlcsp.com
Updated 07/08/2019
China Wafer Level CSP Co., Ltd. engages in the manufacture of semiconductor image sensor chips. It provides wafer-level chip size packaging and testing services. Its products include biometric identification chips, micro-electromechanical system chips, ambient light sensor chips, medical electronic devices, and radiofrequency chips.

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