| HANMI Semiconductor Co., Ltd. engages in the manufacture and sale of semiconductor equipment. It operates through the following business divisions: Semiconductor, Laser, Photovoltaic(PV), and Light Emitting Diode(LED) Manufacturing Equipment, The Semiconductor division provides vision placement, flip chip bonder, electromagnetic interference shield equipment, compression auto mold, manual mold, cam press trim, form, and singulation, inline, inspection, pick and place, and attach and detach. The Laser divison offers laser drilling, cutting, ablation, marking, wafer marking, and cleaning and deflash. |
|
