Technology & Telecommunication Services » Semiconductors | Hanmi Semiconductor Co. Ltd.

Hanmi Semiconductor Co. Ltd. | Balance Sheet

Fiscal year is January-December. All values KRW Millions.
2013
2014
2015
2016
2017
2018
Cash & Short Term Investments
45,931
36,200
35,960
96,123
73,471
24,855
Total Accounts Receivable
33,655
61,104
34,343
39,202
59,844
42,760
Inventories
43,372
38,595
41,823
38,189
29,975
42,520
Other Current Assets
1,428
1,130
1,036
1,525
1,806
3,304
Total Current Assets
124,386
137,029
113,162
175,040
165,097
113,439
Net Property, Plant & Equipment
77,168
51,093
50,324
52,648
57,392
76,172
Total Investments and Advances
35,073
56,926
59,089
53,756
53,130
51,172
Intangible Assets
3,085
3,145
2,944
2,923
4,499
3,457
Other Assets
1,016
68
40
47
51
52
Total Assets
240,728
248,260
225,559
284,988
285,064
246,029
ST Debt & Current Portion LT Debt
4,557
-
-
-
-
Accounts Payable
9,815
8,604
6,359
7,729
12,871
Income Tax Payable
-
10,223
3,873
8,228
8,083
Other Current Liabilities
16,620
18,945
15,751
27,555
40,855
Total Current Liabilities
30,992
37,772
25,983
43,512
61,809
Long-Term Debt
19,659
-
-
28,137
14,772
Provision for Risks & Charges
2,715
1,867
3,132
2,923
1,221
Deferred Taxes
2,237
1,765
1,417
575
4,895
Other Liabilities
2,409
1,904
1,066
1,070
1,089
Total Liabilities
58,011
43,307
31,598
75,644
78,891
Common Equity (Total)
181,122
204,953
193,961
209,345
206,173
Total Shareholders' Equity
181,122
204,953
193,961
209,345
206,173
Total Equity
182,717
204,953
193,961
209,345
206,173
Liabilities & Shareholders' Equity
240,728
248,260
225,559
284,988
285,064
Accumulated Minority Interest
1,596
-
-
-
-

About Hanmi Semiconductor Co.

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Address
14 Gajwa-ro 30beon-gil
Inchon IN 22830
Korea, Republic Of
Employees -
Website http://www.hanmisemi.com
Updated 07/08/2019
HANMI Semiconductor Co., Ltd. engages in the manufacture and sale of semiconductor equipment. It operates through the following business divisions: Semiconductor, Laser, Photovoltaic(PV), and Light Emitting Diode(LED) Manufacturing Equipment, The Semiconductor division provides vision placement, flip chip bonder, electromagnetic interference shield equipment, compression auto mold, manual mold, cam press trim, form, and singulation, inline, inspection, pick and place, and attach and detach. The Laser divison offers laser drilling, cutting, ablation, marking, wafer marking, and cleaning and deflash.

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