Technology & Telecommunication Services » Semiconductors | Hanmi Semiconductor Co. Ltd.

Hanmi Semiconductor Co. Ltd. | Income Statement

Fiscal year is January-December. All values KRW Millions.
2013
2014
2015
2016
2017
2018
Sales/Revenue
113,199
192,310
117,791
166,268
197,300
217,115
Cost of Goods Sold (COGS) incl. D&A
68,050
106,900
63,881
92,142
109,429
120,966
Gross Income
45,150
85,409
53,910
74,126
87,871
96,149
SG&A Expense
31,606
36,325
31,168
35,109
35,754
38,898
EBIT
-
49,085
22,742
39,016
52,117
57,251
Unusual Expense
1,283
10,083
200
1,654
31,885
3,355
Non Operating Income/Expense
2,056
3,958
3,446
5,811
5,338
3,125
Interest Expense
664
975
-
501
1,565
249
Pretax Income
14,829
42,708
26,546
41,060
14,475
62,009
Income Tax
2,538
9,959
6,255
9,615
4,975
12,736
Equity in Affiliates
1,134
1,095
1,509
-
-
-
Consolidated Net Income
11,157
33,844
21,799
31,445
9,500
49,273
Net Income
11,157
33,943
21,799
31,445
9,500
49,273
Net Income After Extraordinaries
11,163
37,964
21,799
31,445
9,500
49,273
Net Income Available to Common
11,152
33,378
21,799
31,445
9,500
49,273
EPS (Basic)
189.60
516.57
372.00
581.20
185.00
965.55
Basic Shares Outstanding
59
58
59
54
51
51
EPS (Diluted)
189.16
493.29
371.87
570.29
185.09
913.88
Diluted Shares Outstanding
61
62
59
56
51
51
EBITDA
18,149
53,680
26,847
43,260
56,606
61,822
Other Operating Expense
171
-
-
-
-
-
Non-Operating Interest Income
1,006
723
558
290
879
398
Minority Interest Expense
-
99
-
-
-
-
Equity in Affiliates (Pretax)
-
-
-
1,902
267
1,871

About Hanmi Semiconductor Co.

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Address
14 Gajwa-ro 30beon-gil
Inchon IN 22830
Korea, Republic Of
Employees -
Website http://www.hanmisemi.com
Updated 07/08/2019
HANMI Semiconductor Co., Ltd. engages in the manufacture and sale of semiconductor equipment. It operates through the following business divisions: Semiconductor, Laser, Photovoltaic(PV), and Light Emitting Diode(LED) Manufacturing Equipment, The Semiconductor division provides vision placement, flip chip bonder, electromagnetic interference shield equipment, compression auto mold, manual mold, cam press trim, form, and singulation, inline, inspection, pick and place, and attach and detach. The Laser divison offers laser drilling, cutting, ablation, marking, wafer marking, and cleaning and deflash.

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