Technology & Telecommunication Services » Semiconductors | QPL International Holdings Ltd.

QPL International Holdings Ltd. | Balance Sheet

Fiscal year is May-April. All values HKD Thousands.
2014
2015
2016
2017
2018
Cash & Short Term Investments
9,600.00
4,686.00
725,882.00
570,669.00
200,306.00
Total Accounts Receivable
71,039.00
50,013.00
70,192.00
139,955.00
140,361.00
Inventories
35,168.00
30,691.00
31,930.00
41,503.00
47,436.00
Other Current Assets
3,836.00
5,052.00
6,014.00
5,370.00
24,697.00
Total Current Assets
119,643.00
90,442.00
834,018.00
757,497.00
412,800.00
Net Property, Plant & Equipment
59,488.00
33,043.00
17,516.00
27,843.00
162,701.00
Total Assets
179,131.00
123,485.00
851,534.00
785,340.00
575,501.00
ST Debt & Current Portion LT Debt
40,796.00
30,858.00
37,585.00
33,724.00
4,744.00
Accounts Payable
24,971.00
25,303.00
23,566.00
27,302.00
32,976.00
Income Tax Payable
746.00
926.00
777.00
833.00
919.00
Other Current Liabilities
37,441.00
37,941.00
31,207.00
28,871.00
33,342.00
Total Current Liabilities
103,954.00
95,028.00
93,135.00
90,730.00
71,981.00
Long-Term Debt
-
-
967.00
964.00
457.00
Deferred Taxes
1.00
1.00
8,586.00
-
-
Total Liabilities
103,955.00
95,029.00
102,688.00
91,694.00
72,438.00
Common Equity (Total)
75,176.00
28,456.00
748,846.00
693,646.00
503,063.00
Total Shareholders' Equity
75,176.00
28,456.00
748,846.00
693,646.00
503,063.00
Total Equity
75,176.00
28,456.00
748,846.00
693,646.00
503,063.00
Liabilities & Shareholders' Equity
179,131.00
123,485.00
851,534.00
785,340.00
575,501.00

About QPL International Holdings

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Address
8th floor, Hale Weal Industrial Bldg
Hong Kong
Hong Kong
Employees -
Website http://www.qpl.com
Updated 07/08/2019
QPL International Holdings Ltd. manufactures and sells integrated circuit lead frames, heat sinks and stiffeners. Its products include High Density Etch Backs, High Density Leadframes, Plastic Dual In-lines/Shrink Plastic Dual In-line Packages, Plastic Lead Clip Carriers, Quad Flat Non-Leads, Quad Flat Packs/Thin Quad Flat Packs, Small Outline Integrated Circuits, Thermal Enhanced Products, and Lead On Chips. The company was founded on January 20, 1989 and is headquartered in Hong Kong.