Technology & Telecommunication Services » Semiconductors | QPL International Holdings Ltd.

QPL International Holdings Ltd. | Income Statement

Fiscal year is May-April. All values HKD Thousands.
2014
2015
2016
2017
2018
Sales/Revenue
262,714.00
262,303.00
287,021.00
280,719.00
315,861.00
Cost of Goods Sold (COGS) incl. D&A
195,677.00
216,426.00
231,826.00
215,657.00
274,802.00
Gross Income
67,037.00
45,877.00
55,195.00
65,062.00
41,059.00
SG&A Expense
71,436.00
74,327.00
92,012.00
76,005.00
86,472.00
EBIT
4,399.00
28,450.00
31,307.00
6,014.00
45,413.00
Unusual Expense
4,156.00
22,152.00
28,778.00
59,379.00
47,517.00
Non Operating Income/Expense
11,982.00
6,177.00
2,568.00
2,632.00
126,189.00
Interest Expense
733.00
1,071.00
1,099.00
1,122.00
43.00
Pretax Income
2,699.00
45,491.00
1,054.00
62,444.00
210,294.00
Income Tax
1,044.00
1,245.00
9,937.00
7,294.00
1,129.00
Consolidated Net Income
1,655.00
46,736.00
10,991.00
55,150.00
211,423.00
Net Income
1,655.00
46,736.00
10,991.00
55,150.00
211,423.00
Net Income After Extraordinaries
1,655.00
46,736.00
10,991.00
55,150.00
211,423.00
Net Income Available to Common
1,655.00
46,736.00
10,991.00
55,150.00
211,423.00
EPS (Basic)
0.01
0.21
0.03
0.02
0.09
Basic Shares Outstanding
225,584.70
225,584.70
367,901.00
2,256,265.30
2,256,265.30
EPS (Diluted)
0.01
0.21
0.03
0.02
0.09
Diluted Shares Outstanding
225,584.70
225,584.70
367,901.00
2,256,265.30
2,256,265.30
EBITDA
8,857.00
15,275.00
26,684.00
4,028.00
38,760.00
Other Operating Expense
-
-
5,510.00
4,929.00
-
Non-Operating Interest Income
5.00
5.00
6.00
1,439.00
8,868.00

About QPL International Holdings

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Address
8th floor, Hale Weal Industrial Bldg
Hong Kong
Hong Kong
Employees -
Website http://www.qpl.com
Updated 07/08/2019
QPL International Holdings Ltd. manufactures and sells integrated circuit lead frames, heat sinks and stiffeners. Its products include High Density Etch Backs, High Density Leadframes, Plastic Dual In-lines/Shrink Plastic Dual In-line Packages, Plastic Lead Clip Carriers, Quad Flat Non-Leads, Quad Flat Packs/Thin Quad Flat Packs, Small Outline Integrated Circuits, Thermal Enhanced Products, and Lead On Chips. The company was founded on January 20, 1989 and is headquartered in Hong Kong.

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