Shenzhen Danbond Technology Co. Ltd. | |
Stock Exchange | Shenzhen Stock Exchange |
EPS |
CNY0.04 |
Market Cap |
CNY7.44 B |
Shares Outstanding |
547.92 M |
Public Float |
292.45 M |
Address |
Danbang Technology Building Shenzhen Guangdong 518057 China |
Employees | - |
Website | http://www.danbang.com |
Updated | 07/08/2019 |
Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China. |