Technology & Telecommunication Services » Semiconductors | Shenzhen Danbond Technology Co. Ltd.

Shenzhen Danbond Technology Co. Ltd.

Shenzhen Danbond Technology Co. Ltd.
Stock Exchange Shenzhen Stock Exchange
EPS
CNY0.04
Market Cap
CNY7.44 B
Shares Outstanding
547.92 M
Public Float
292.45 M

Profile

Address
Danbang Technology Building
Shenzhen Guangdong 518057
China
Employees -
Website http://www.danbang.com
Updated 07/08/2019
Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China.

Financials

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Ping Liu
Chairman & General Manager
Ling Man Pan
Independent Director