Technology & Telecommunication Services » Semiconductors | Shenzhen Danbond Technology Co. Ltd.

Shenzhen Danbond Technology Co. Ltd. | Mutual Funds

Mutual Funds that own Shenzhen Danbond Technology Co. Ltd.

Name
Shares Held
% Shares Out
Change In Shares
% of Assets
As of Date
1,865,286
0.34%
0
2.38%
12/31/2017
Vanguard Emerging Markets Stock Index Fund
446,643
0.08%
0
0%
07/31/2018
First State Cinda Elite Flexible Allocation Balanced Fund
52,092
0.01%
52,092
1.54%
12/31/2017
8,750
0%
-800
0.24%
12/31/2017
6,935
0%
6,935
0.03%
12/31/2017
6,050
0%
-1,100
0.23%
12/31/2017
1,473
0%
-300
0.26%
12/31/2017
Harvest Thematic Select Fund
0
0%
-5,751,765
0%
12/31/2017
0
0%
-9
0%
12/31/2017
0
0%
-68,791
0%
12/31/2017

About Shenzhen Danbond Technology Co.

View Profile
Address
Danbang Technology Building
Shenzhen Guangdong 518057
China
Employees -
Website http://www.danbang.com
Updated 07/08/2019
Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China.

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