Technology & Telecommunication Services » Semiconductors | United Microelectronics Corp.

United Microelectronics Corp. | Balance Sheet

Fiscal year is January-December. All values TWD Millions.
2013
2014
2015
2016
2017
2018
Cash & Short Term Investments
53,598
46,441
53,955
58,293
82,391
84,190
Total Accounts Receivable
17,602
23,062
19,989
24,003
22,657
24,697
Inventories
13,993
15,242
17,641
16,998
18,258
18,203
Other Current Assets
3,603
12,117
3,231
11,176
15,855
14,104
Total Current Assets
88,796
96,863
94,817
110,470
139,160
141,193
Net Property, Plant & Equipment
162,763
167,754
188,767
226,162
206,028
173,508
Total Investments and Advances
33,171
38,507
41,225
35,871
35,146
35,761
Intangible Assets
4,740
4,533
4,504
4,088
3,788
2,992
Other Assets
3,741
3,344
5,759
5,083
3,906
4,763
Total Assets
295,903
313,246
337,367
386,655
394,099
364,605
ST Debt & Current Portion LT Debt
21,189
10,026
12,107
31,052
52,809
Accounts Payable
7,414
6,167
5,954
6,855
6,536
Income Tax Payable
961
2,541
-
-
4,098
Other Current Liabilities
18,640
29,372
30,184
34,072
24,619
Total Current Liabilities
48,204
48,106
48,246
71,978
88,061
Long-Term Debt
28,821
33,401
49,097
62,301
54,891
Provision for Risks & Charges
3,798
3,825
3,891
3,969
4,139
Deferred Taxes
175
84
621
3,139
4,440
Other Liabilities
528
743
7,214
20,987
21,137
Total Liabilities
83,868
88,237
110,122
161,077
169,860
Common Equity (Total)
207,715
221,159
225,218
215,008
211,509
Total Shareholders' Equity
207,715
221,159
225,218
215,008
211,509
Total Equity
212,035
225,009
227,245
217,170
212,465
Liabilities & Shareholders' Equity
295,903
313,246
337,367
386,655
394,099
Accumulated Minority Interest
4,320
3,850
2,027
2,162
957
Non-Equity Reserves
-
-
-
8,408
11,774

About United Microelectronics

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Address
No. 3, 2nd Li-Hsin Road
Hsinchu 300 78
Taiwan
Employees -
Website http://www.umc.com
Updated 07/08/2019
United Microelectronics Corp. engages in the semiconductor foundry business. It offers complementary metal-oxide semiconductor (CMOS) logic wafers, mixed signal wafers, radio frequency complementary metal-oxide semiconductor wafers, embedded memory products, high voltage integrated circuits (ICs), and complementary metal-oxide semiconductor image sensors. The company was founded on May 22, 1980 and is headquartered in Hsinchu, Taiwan.