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Global semiconductor wafer-level packing and assembly equipment spending 2014-2020

Wafer-level packaging and assembly equipment spending for semiconductor industry worldwide from 2014 to 2020 (Figures expressed in billions of U.S. dollars, unless otherwise specified)

The data illustrates the level of wafer-level packaging and assembly equipment spending worldwide, from 2014 to 2020. In 2017, waver-level packaging and assembly equipment spending is forecast to reach 2.03 billion USD.

2014	1.73
2015	1.76
2016	1.83
2017	2.03
2018	2.25
2019	2.51
2020	2.57

Global semiconductor wafer-level packing and assembly equipment spending 2014-2020

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