Materials & Resources » Chemicals | Sumitomo Bakelite Co. Ltd.

Sumitomo Bakelite Co. Ltd. | Key People and Executives

Shigeru Hayashi
Chairman
Kazuhiko Fujiwara
President & Representative Director
Sumitoshi Asakuma
Director, Managing Executive Officer, Head-R&D
Takashi Kobayashi
Director & Managing Executive Officer
Goichiro Kuwaki
Director & Managing Executive Officer
Takuji Nakamura
Director & Senior Managing Executive Officer
Shigeki Muto
Representative Director & Executive Vice President
Masayuki Inagaki
Director & Senior Managing Executive Officer
Noboru Yamawaki
Director & Senior Managing Executive Officer
Hiroshi Ueda
Director
Kazuo Matsuda
Director
Hiroyuki Abe
Independent Director
Shigeru Hayashi
Chairman
Kazuhiko Fujiwara
President & Representative Director
Sumitoshi Asakuma
Director, Managing Executive Officer, Head-R&D
Takashi Kobayashi
Director & Managing Executive Officer
Goichiro Kuwaki
Director & Managing Executive Officer
Takuji Nakamura
Director & Senior Managing Executive Officer
Shigeki Muto
Representative Director & Executive Vice President
Masayuki Inagaki
Director & Senior Managing Executive Officer
Henny van Dijk
Managing Executive Officer
Noriyoshi Honda
General Manager-General Affairs
Noboru Yamawaki
Director & Senior Managing Executive Officer
Takao Akasaka
Auditor
Tamotsu Yahata
Auditor
Hiroshi Ueda
Director
Kazuo Matsuda
Director
Tatsuo Yoshihara
Managing Executive Officer & Head-Plate Sales
Shin Yamaguchi
Manager-Accounting & Investor Relations Contact
Hiroyuki Abe
Independent Director

About Sumitomo Bakelite Co.

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Address
Tennoz Parkside Building
Tokyo Tokyo 140
Japan
Employees -
Website http://www.sumibe.co.jp
Updated 07/08/2019
Sumitomo Bakelite Co., Ltd. engages in the manufacture and sale of phenolic resin and plastic products. It operates through the following segments: Semiconductor Materials, Circuit Products, High-performance Plastics, Quality of Life Products, and Others. The Semiconductor Materials segment includes epoxy resin molding compounds for encapsulation of semiconductor devices; positive-type photosensitive coating resins for semiconductor wafers; pastes for die bonding; carrier tapes for mounting semiconductor components; adhesive tapes for assembling semiconductors; and semiconductor substrate materials.