Industrial Goods » Industrial Electronics | TTM Technologies Inc.

TTM Technologies Inc. | Key People and Executives

Thomas T. Edman
President, Chief Executive Officer & Director
Chung-Yen Tang
Non-Independent Director
Robert E. Klatell
Chairman
Chantel E. Lenard
Independent Director
Rex D. Geveden
Independent Director
Philip G. Franklin
Independent Director
Kenton K. Alder
Independent Director
Julie Spicer England
Independent Director
Dov S. Zakheim
Independent Director
John G. Mayer
Independent Director
Thomas T. Edman
President, Chief Executive Officer & Director
Brian W. Barber
Chief Operating Officer & Executive VP
Todd Blake Schull
Chief Financial Officer, Treasurer & Executive VP
Dale Knecht
Senior VP-Global Information Technology
Jon P. Pereira
President-Automotive & Medical Division
Tai Keung Chung
Executive VP-Asia Pacific Business Development
Anthony Princiotta
President-Electro Mechanical Solutions
Philip Titterton
President-Aerospace, Defense & Specialty Division
Chung-Yen Tang
Non-Independent Director
William Kent Hardwick
Senior Vice President-Global Sales
Anthony Sanchez
Vice President & Controller
Sameer Desai
Senior Director-Investor Relations
Douglas L. Soder
President-Communications & Computing Business
Shawn Powers
Senior Vice President-Human Resources
Daniel J. Weber
Secretary, Senior VP & General Counsel
Robert E. Klatell
Chairman
Chantel E. Lenard
Independent Director
Rex D. Geveden
Independent Director
Philip G. Franklin
Independent Director
Kenton K. Alder
Independent Director
Julie Spicer England
Independent Director
Dov S. Zakheim
Independent Director
John G. Mayer
Independent Director

About TTM Technologies

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Address
200 East Sandpointe
Santa Ana California 92707
United States
Employees -
Website http://www.ttmtech.com
Updated 07/08/2019
TTM Technologies, Inc. engages in the manufacture and sale of printed circuit boards and backplane assemblies. It operates through the Printed Circuit Board and Electro-Mechanical Solutions segments. It offers products such as backplanes, system integration, chassis assemblies, integrated circuit substrates and chips, and engineering services.