Technology & Telecommunication Services » Semiconductors | Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp. | Income Statement

Fiscal year is January-December. All values TWD Millions.
2013
2014
2015
2016
2017
2018
Sales/Revenue
23,103
24,944
23,061
23,165
22,335
23,728
Cost of Goods Sold (COGS) incl. D&A
17,128
18,255
17,378
17,816
18,851
18,805
Gross Income
5,974
6,689
5,683
5,349
3,485
4,923
SG&A Expense
2,539
2,679
2,619
2,759
3,057
4,131
EBIT
3,435
4,009
3,064
2,590
428
792
Unusual Expense
23
27
33
21
20
44
Non Operating Income/Expense
166
75
146
12
176
122
Interest Expense
56
56
57
71
79
121
Pretax Income
3,663
4,151
3,205
2,582
607
810
Income Tax
547
661
476
496
194
299
Equity in Affiliates
-
-
-
13
78
100
Consolidated Net Income
3,116
3,490
2,730
2,073
335
411
Net Income
3,224
3,617
2,904
2,234
492
349
Net Income After Extraordinaries
3,224
3,617
2,904
2,234
492
349
Net Income Available to Common
3,224
3,617
2,904
2,234
492
349
EPS (Basic)
7.23
8.11
6.51
5.01
1.10
0.78
Basic Shares Outstanding
446
446
446
445
446
446
EPS (Diluted)
7.12
7.98
6.38
4.95
1.10
0.78
Diluted Shares Outstanding
453
453
455
451
448
448
EBITDA
6,366
7,054
6,295
6,085
3,872
5,005
Non-Operating Interest Income
87
96
86
72
62
62
Minority Interest Expense
108
127
174
161
156
62

About Kinsus Interconnect Technology

View Profile
Address
No. 1245 Zhonghua Road
Taoyuan 327 47
Taiwan
Employees -
Website http://www.kinsus.com.tw
Updated 07/08/2019
Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. It specializes in plastic ball grid array, wire bond chip-scale package, cavity down, system-in-package, flip chip, radio frequency module, chip on board light-emitting diode, and chip-on-film. The company was founded on September 11, 2000 and is headquartered in Taoyuan, Taiwan.

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