Technology & Telecommunication Services » Semiconductors | Shenzhen Danbond Technology Co. Ltd.

Shenzhen Danbond Technology Co. Ltd. | Balance Sheet

Fiscal year is January-December. All values CNY Millions.
2013
2014
2015
2016
2017
2018
Cash & Short Term Investments
559
259
293
174
97
28
Total Accounts Receivable
149
322
341
344
290
246
Inventories
18
28
25
33
59
112
Other Current Assets
267
285
82
129
1
1
Total Current Assets
993
895
740
680
447
387
Net Property, Plant & Equipment
904
1,210
1,500
1,518
1,563
1,834
Intangible Assets
139
132
140
166
193
190
Other Assets
-
1
1
2
384
3
Total Assets
2,038
2,242
2,387
2,372
2,591
2,419
ST Debt & Current Portion LT Debt
200
200
410
470
580
Accounts Payable
15
44
39
30
17
Income Tax Payable
3
9
1
6
3
Other Current Liabilities
13
19
18
11
15
Total Current Liabilities
231
272
467
517
614
Long-Term Debt
280
360
250
170
267
Deferred Taxes
1
5
5
6
4
Other Liabilities
1
-
-
-
-
Total Liabilities
512
632
717
687
881
Common Equity (Total)
1,509
1,593
1,651
1,670
1,693
Total Shareholders' Equity
1,509
1,593
1,651
1,670
1,693
Total Equity
1,509
1,593
1,651
1,670
1,693
Liabilities & Shareholders' Equity
2,038
2,242
2,387
2,372
2,591
Non-Equity Reserves
16
17
18
16
17

About Shenzhen Danbond Technology Co.

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Address
Danbang Technology Building
Shenzhen Guangdong 518057
China
Employees -
Website http://www.danbang.com
Updated 07/08/2019
Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China.