Shenzhen Danbond Technology Co. Income Statement

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Shenzhen Danbond Technology Co. Ltd. | Income Statement

Fiscal year is January-December. All values CNY Thousands.

2013

2014

2015

2016

2017

2018

Sales/Revenue

286,713.90

502,048.80

415,889.20

265,291.80

309,662.50

338,057.70

Cost of Goods Sold (COGS) incl. D&A

155,466.90

306,745.00

273,868.00

184,606.50

216,095.30

228,769.50

Gross Income

131,247.10

195,303.80

142,021.10

80,685.30

93,567.30

109,288.20

SG&A Expense

51,252.60

77,554.60

67,223.50

52,652.60

37,481.50

55,219.40

EBIT

78,176.20

116,285.00

71,285.00

26,943.20

56,085.80

52,459

Unusual Expense

691.60

Non Operating Income/Expense

4,844.80

897.00

20,950.30

21,801.40

11,429.70

13,479.30

Interest Expense

21,808.20

18,902.70

24,821.00

23,529.40

37,265.20

40,136.70

Pretax Income

63,471.60

109,868.20

75,782.20

26,250.10

30,626.00

25,924.90

Income Tax

11,056.40

18,934.50

8,912.70

1,660.20

5,252.40

509.70

Consolidated Net Income

52,415.20

90,933.70

66,869.50

24,589.90

25,373.60

25,415.20

Net Income

52,415.20

90,933.70

66,869.50

24,589.90

25,373.60

25,415.20

Net Income After Extraordinaries

52,415.20

90,933.70

66,869.50

24,589.90

25,373.60

25,415.20

Net Income Available to Common

52,415.20

90,933.70

66,869.50

24,589.90

25,373.60

25,415.20

EPS (Basic)

0.11

0.17

0.12

0.05

Basic Shares Outstanding

496,980.50

547,920.50

547,920.00

547,920

EPS (Diluted)

0.11

0.17

0.12

0.04

0.05

Diluted Shares Outstanding

496,980.50

547,920.50

547,920.00

547,920

EBITDA

132,711.40

195,471.80

151,888.30

118,918.20

180,396.30

202,478.10

Other Operating Expense

1,818.20

1,464.30

3,512.60

1,089.40

1,609.80

Non-Operating Interest Income

1,327.90

2,629.30

981.70

981.90

375.70

123.40

About Shenzhen Danbond Technology Co.

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Address	Danbang Technology Building Shenzhen Guangdong 518057 China
Employees	-
Website	http://www.danbang.com
Updated	07/08/2019
Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China.

Shenzhen Danbond Technology Co. Ltd. | Income Statement

About Shenzhen Danbond Technology Co.

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