Technology & Telecommunication Services » Semiconductors | Shenzhen Danbond Technology Co. Ltd.

Shenzhen Danbond Technology Co. Ltd. | Ownership

Companies that own Shenzhen Danbond Technology Co. Ltd.

Name
Shares Held
% Shares Out
Change In Shares
% of Assets
As of Date
Harvest Fund Management Co., Ltd.
5,751,765
1.05%
-7,468,572
0.12%
09/30/2017
The Vanguard Group, Inc.
446,643
0.08%
0
0%
07/31/2018
First State Cinda Fund Management Co. Ltd.
59,027
0.01%
59,027
0.03%
12/31/2017
China Southern Asset Management Co., Ltd.
8,750
0%
-800
0%
12/31/2017
Hwabao WP Fund Management Co., Ltd.
6,050
0%
-1,100
0%
12/31/2017
Guotai Junan Allianz Fund Management Co., Ltd.
1,473
0%
-300
0%
12/31/2017
SWS MU Fund Management Co., Ltd.
0
0%
-68,791
0%
12/31/2017
China Universal Asset Management Co., Ltd.
0
0%
-9
0%
12/31/2017
Tian Hong Asset Management Co., Ltd.
0
0%
-7,200
0%
12/31/2017

About Shenzhen Danbond Technology Co.

View Profile
Address
Danbang Technology Building
Shenzhen Guangdong 518057
China
Employees -
Website http://www.danbang.com
Updated 07/08/2019
Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China.