Technology & Telecommunication Services » Semiconductors | Shenzhen Danbond Technology Co. Ltd.

Shenzhen Danbond Technology Co. Ltd. | Key People and Executives

Ping Liu
Chairman & General Manager
Ling Man Pan
Independent Director
Ping Liu
Chairman & General Manager
Feng Xuan Zhou
Chief Financial Officer
Ling Man Pan
Independent Director

About Shenzhen Danbond Technology Co.

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Address
Danbang Technology Building
Shenzhen Guangdong 518057
China
Employees -
Website http://www.danbang.com
Updated 07/08/2019
Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China.